X-ray inspection, the traversal of the components within the 360 ° all-round observation, to determine the internal structure of components under test and package connection status, you can see a large number of samples under test are the same, or a mixture (Mixed-Up ) the problems arise; in addition they have with the specifications (Datasheet) each other than to understand the correctness of the sample under test. Connection status of the test package, to learn about the chip and package connectivity between pins is normal, to exclude the key and open-wire short-circuited.